Resin sealing mold and resin sealing method

ABSTRACT

A resin sealing mold for semiconductor devices, which is designed to thoroughly accommodate board thickness variations and prevent formation of burrs and which is easy to maintain. To this end, a plurality of pistons ( 42 ) supporting, at one of their respective ends, lower mold cavities ( 56 ) have the other ends thereof slidably inserted in hydraulic cylinder blocks installed on lower mold sets ( 40 ).

This application is the national phase under 35 U.S.C. § 371 of PCTInternational Application No. PCT/JP00/08842 which has an Internationalfiling date of Dec. 14, 2000, which designated the United States ofAmerica.

TECHNICAL FIELD

The present invention relates to a mold apparatus for resinencapsulation used for encapsulating an electronic component such as asemiconductor device, and in particular, to a mold apparatus for resinencapsulation and a method of resin encapsulation used for encapsulatingan electronic component disposed on at least one side of a plasticsubstrate board.

BACKGROUND ART

FIG. 29 shows a prior art example of a mold apparatus for resinencapsulation of an electronic component such as a semiconductor device.The apparatus comprises: an upper mold set 1 involving an upper chase 2;and a lower mold set 3 involving a lower chase 4. The lower mold set 3is pushed up, whereby this lower mold set 3 is pressed and clampedagainst the upper mold set 1. A substrate board 7 is thereby sustainedbetween cavity bars 5 installed in the lower surface of the upper chase2 and cavity bars 6 installed in the upper surface of the lower chase 4.Then, a plunger 3 a is ejected by a driving mechanism which is not shownin the figure, whereby a solid tablet 8 in a pot 3 b undergoes a heatingcompression to fluidity, and whereby an electronic component (not shown)mounted on the surface of said substrate board 7 is encapsulated withresin. In said mold apparatus, the variation (maximum 0.02 mm) ofthickness among metallic substrate boards 7, such as lead frames, hasbeen compensated by the elastic deformation of elastic pins 2 a in theaxial direction. Further, numeral 9 designates a support blockconstituting said lower mold set 3.

However, the needs for resin encapsulation of plastic substrate boards,such as so-called substrates, have been growing in recent years. Thevariation (maximum 0.2 mm) of thickness among plastic substrate boardsis generally much larger than that among metallic substrate boards. Suchvariation of board thickness is difficult to be compensated completelyby said elastic pins 2 a having a small capacity for elasticdeformation. Therefore, a gap is unavoidable to occur, thereby causing aflash frequently. In addition to this incapability, the increase of thedisplacement causes said elastic pins 2 a easily to fatigue failure,thereby requiring an early-stage change, thereby increasing themaintenance work. Further, in the above-mentioned example of the priorart, the elastic pins 2 a need a change depending on the substrate boardto encapsulate with resin because of the small capacity of the elasticpins 2 a for elastic deformation. The change takes a lot of troublesduring disassembling and reassembling the mold apparatus. Thus, a methodhas been proposed to use overlaying such as plural conical bellevillesprings (not shown) having a larger capacity for elastic deformationthan said elastic pins 2 a. However, said conical belleville springshave a problem of variation in spring force (recoiling force) and afurther problem that the spring force (recoiling force) changes due tothe heating compression strokes.

Considering said problems, a first object of the present invention is toprovide a mold apparatus for resin encapsulation, which is capable ofcompensating completely a large variation of thickness mainly amongplastic substrate boards, thereby avoiding the occurrence of a flash,and is easy of maintenance.

On the other hand, a mold-clamping force corresponding to the resinencapsulation of a plastic substrate board is insufficient as themold-clamping force for the resin encapsulation of a metallic substrateboard (lead frame and the like). Thus, the metallic substrate boardcannot be encapsulated with resin.

For the information, a mold-clamping force of about 1–5 kg/mm² issufficient for a plastic substrate board, which can be generated by asmall oil hydraulic cylinder capable of being built in the moldapparatus. In contrast, with regard to the mold-clamping force formetallic substrate boards, a copper lead frame needs a mold-clampingforce of 20–30 kg/mm², and a steal lead frame needs a mold-clampingforce of 25–40 kg/mm². Thus, a large mechanism for oil pressuregeneration is necessary if used, as well as a large cylinder and thelike. Therefore, overall system becomes so large as not to be built inthe mold apparatus. On the contrary, if a plastic substrate board isapplied with a mold-clamping force of the same order as that for ametallic substrate board, the plastic substrate board deforms andeventually breaks in a worst case.

As such, a plastic substrate board and a metallic substrate board cannotbe encapsulated by common mold sets, and each substrate board requiresexclusive mold sets and chases. Thus, there have been a problem ofincreased cost and a problem of a lot of time necessary for the changethereof.

Considering said problems, a second object of the present invention isto provide a mold apparatus for resin encapsulation, capable ofprocessing not only a plastic substrate board but also a metallicsubstrate board.

Further, when a plastic substrate board is clamped indiscriminately witha strong clamping force, the plastic substrate board is easily deformed,and hence, assembled components, such as semiconductor devices andespecially wires, are easily damaged. On the contrary, when saidsubstrate board is clamped indiscriminately with so weak a clampingforce as not to cause a deformation, a gap occurs between the substrateboard and the mold, causing a problem of the unavoidable occurrence of aflash.

A third object of the present invention is to provide a method of resinencapsulation and a mold apparatus for resin encapsulation, capable ofsimultaneously resolving the two problems of the damage to an mountedcomponent and of the occurrence of a flash.

DISCLOSURE OF INVENTION

In order to achieve the first object, in a mold apparatus for resinencapsulation, wherein a substrate board is clamped by both an uppermold disposed in the lower surface of an upper mold set and a lower molddisposed in the upper surface of a lower mold set, wherein a plungerprovided in any one of said mold sets is extruded whereby solid resinfor encapsulation is fluidified, and wherein an electronic componentmounted on the surface of said substrate board is encapsulated with theresin, a mold for resin encapsulation of a semiconductor device inaccordance with the present invention is configured so that any one ofsaid molds is supported by a plurality of pistons provided in paralleland that said pistons are inserted slidably within an oil hydrauliccylinder block provided in said mold set.

In accordance with the present invention, even when the variation inthickness of substrate boards to encapsulate is large, the variation inthickness is compensated by the movement of the pistons sliding up anddown within the oil hydraulic cylinder block. Accordingly, no gap occursbetween the cavity and the substrate board, and the press is carried outunder a constant pressure. Therefore, the occurrence of a flash isavoided, and hence the yield rate of encapsulated products is improved.

In a mold apparatus for resin encapsulation, wherein a substrate boardis clamped by both an upper mold disposed in the lower surface of anupper mold set and a lower mold disposed in the upper surface of a lowermold set, wherein a plunger provided in the lower mold set is extrudedwhereby solid resin for encapsulation is fluidified, and wherein anelectronic component mounted on the surface of said substrate board isencapsulated with the resin, an embodiment of the present invention maybe configured so that said lower mold is supported by plural pistonsprovided in parallel and that the lower end sections of said pistons areinserted slidably within an oil hydraulic cylinder block provided insaid lower mold set.

As such, in accordance with the present invention, similarly to theabove-mentioned configuration, even when the variation in thickness ofsubstrate boards is large, the variation is compensated by the movementof the lower end sections of the pistons sliding within the oilhydraulic cylinder block. Accordingly, no gap occurs between thesubstrate board and the upper mold or the lower mold, and the press iscarried out under a constant pressure. Therefore, the occurrence of aflash is avoided.

In one embodiment of the present invention, an oil hydraulic cylinderblock may be clamped by a base plate and a base plate for chaseconstituting the top and the bottom of a lower mold set.

In the prior art, a support block for supporting the center section ofthe base plate for chase has been provided between the base plate andthe base plate for chase. In contrast, in accordance with the presentinvention, said oil hydraulic cylinder block can serve also the functionof the support block without a considerable increase in the number ofcomponents.

In another embodiment, said lower mold supported by the pistons may beattachable onto and detachable from the upper surface of said lower moldset.

In accordance with this embodiment, the mold can be easily removed forcleaning, and the maintenance becomes simple.

In another preferable embodiment, said plural pistons provided inparallel may be linked by a synchronization bar. As a result, no timelag occurs in the operation of the pistons, and the response is muchimproved. Thus, the mold is pushed up simultaneously, and hence theoperation is carried out on the level without slanting or deforming.Therefore, the yield rate of encapsulated products is improved.

Each of plural pistons provided in parallel and a base plate supportingthe middle sections of the pistons and constituting a lower mold set maybe provided with respective through holes, for operation check, capableof communicating in a common straight line.

In this embodiment, when the through holes for operation check of thepistons are not located in the same line as the through hole foroperation check of the base plate, the light to pass through saidthrough holes is interrupted, thereby indicating the occurrence of anabnormal event such as a jam. As such, the state of operation can bechecked via said through hole, which makes the situation safe andconvenient.

In another embodiment, a guiding mechanism section comprising: anup-down movable block moving downwardly by being pressed by the lowersurface of an upper mold set; and a guiding block moving sidewardly to aguiding position of said lower mold by being pressed by the taperedsurface of the up-down movable block; for guiding a lower mold with saidguiding block during the mold clamping and for releasing said guidingblock during the mold opening may be disposed in the vicinity of anoutward surface of said lower mold installed to said lower mold set,that is, in the sideward and push-pull direction.

In this embodiment, the guiding block is positioned in the guidingposition only during the mold clamping. Thus, no scuffing occurs on theguiding block, thereby resulting in the effect of avoiding possibledamage to a component.

In order to achieve the second object, in a mold apparatus for resinencapsulation, wherein a substrate board is clamped by both an uppermold disposed in the lower surface of an upper mold set and a lower molddisposed in the upper surface of a lower mold set, wherein a plungerprovided in any one of said mold sets is extruded whereby solid resinfor encapsulation is fluidified, and wherein an electronic componentmounted on the surface of said substrate board is encapsulated with theresin, a mold apparatus for resin encapsulation in accordance with thepresent invention is configured so that an oil hydraulic cylinder blockto which one end of each of plural pistons supporting any one of saidmolds is inserted slidably is provided in any one of said upper mold setand said lower mold set so as to be changeable with a normal base block.

In a mold apparatus for resin encapsulation, wherein a substrate boardis clamped by both an upper mold disposed in the lower surface of anupper mold set and a lower mold disposed in the upper surface of a lowermold set, wherein a plunger provided in any one of said mold sets isextruded whereby solid resin for encapsulation is fluidified, andwherein an electronic component mounted on the surface of said substrateboard is encapsulated with the resin, the present invention may beconfigured so that an oil hydraulic cylinder block to which one end ofeach of plural pistons supporting said lower mold is inserted slidablyis provided in said lower mold set so as to be changeable with a normalbase block comprising an ejector rod.

Further, in an embodiment of the present invention, an apparatus may beconfigured so that an oil hydraulic cylinder block is slidably engagedto a base plate for chase constituting a lower mold set so as to bechangeable with a normal base block comprising an ejector rod.

Further, an apparatus may be configured so that an oil hydrauliccylinder block is slidably engaged to a base plate constituting an uppermold set so as to be changeable with a normal base block.

Said normal base block may be separable into plural small blocks.

In accordance with the present invention, even when the variation inthickness of substrate boards large, it is compensated by the movementof said pistons sliding within the oil hydraulic cylinder block.Accordingly, no gap occurs between the mold and the substrate board, andthe press is carried out under a constant pressure. Therefore, theoccurrence of a flash is avoided.

Further, only by changing the oil hydraulic cylinder block with thenormal base block or the normal base block comprising an ejector rod, ametallic substrate board can be encapsulated with resin as well as aplastic substrate board. As such, it is unnecessary to change theoverall mold set with a exclusive mold set for metallic substrateboards, which permits a considerable reduction of time for componentchange. It is also obviously unnecessary to purchase a mold apparatusfor resin encapsulation dedicated for metallic substrate boards.

In an embodiment of the present invention, an apparatus may beconfigured so that a heat insulating plate is disposed in at least onelinkage section between a lower mold and a space block, a side block, oran end block constituting a lower mold set. Further, an apparatus may beconfigured so that a heat insulating plate is disposed in at least onelinkage section between a lower mold and a space block, a support block,or a piston of a lower chase.

In accordance with the present embodiment, the temperature rise of theoil and the like in a cylinder block can be suppressed, whereby a stablepressure can be supplied and the deterioration of the oil and the likedue to high temperature can be prevented.

In another embodiment of the present invention, an apparatus may beconfigured so that a lower chase involving a lower mold is slidablyengaged to a lower mold set so as to be attachable thereto anddetachable therefrom.

In accordance with this embodiment, the mold can be easily removed forcleaning, and the maintenance becomes simple.

In an embodiment of the present invention, an apparatus may beconfigured so that plural pistons provided in parallel are linked by asynchronization bar.

In accordance with the present embodiment, a mold is pushed upsimultaneously, and hence the operation is carried out keeping thelevel. Thus, no time lag occurs in the operation of the pistons, and theresponse is much improved. Further, without slanting or deforming of themold, the yield rate of encapsulated products is improved.

In another embodiment of the present invention, an apparatus may beconfigured so that a heater is disposed in the vicinity of a pot intowhich solid resin for encapsulation is put.

In accordance with the present embodiment, the solid resin is suppliedwith a constant heat, which stabilizes the encapsulation condition ofthe resin, which causes the effect that encapsulated products with astable quality can be provided and that the yield rate is improved.

In order to resolve the above-mentioned third problem, in a method ofresin encapsulation, wherein a plastic substrate board is clampedbetween a fixed side mold and a movable side mold, and wherein resin isfilled into the formed cavity, thereby encapsulating an mountedcomponent on the surface of said substrate board with the resin, amethod of the present invention comprises: a first clamping step ofclamping said substrate board with said both molds using a force of astrength not causing a trouble to the mounted component due to thedeformation of said substrate board; a first resin filling step offilling the resin into a cavity formed by said both molds to an extentthat the mounted component is almost covered; a second clamping step ofclamping the member to be clamped, with said both molds in an ordinarymanner; and a second resin filling step of filling the resin completelyin the cavity formed by said both molds.

In said first clamping step, the clamping is carried out with a force of70–80% of the ordinary force. In said first resin filling step, theresin is filled by an amount of 80–90% of the complete filling.

In order to resolve said problem, in a mold apparatus for resinencapsulation, wherein a plastic substrate board is clamped between afixed side mold and a movable side mold, and wherein resin is filledinto the formed cavity, thereby encapsulating an mounted component onthe surface of said substrate board with the resin, an apparatus of thepresent invention is configured so that at least the area for clampingthe plastic substrate board of said movable side mold is constituted ofa clamping member movable in the clamping direction and that theapparatus comprises a driving mechanism for moving said clamping memberthereby to clamp the plastic substrate board between the both molds witha clamping force of a strength not causing a trouble to the mountedcomponent due to the deformation of said substrate board or an ordinaryclamping force.

Said driving mechanism is constituted of a hydraulic pressure generatingcylinder mechanism for driving a clamping member by the hydraulicbalance between a piston extruding liquid chamber and a pistonretracting liquid chamber. A pressure sensor is provided for detectingthe hydraulic pressure of the extruding liquid chamber in a hydraulicpressure generating cylinder of the hydraulic pressure generatingcylinder mechanism. Said hydraulic pressure generating cylindermechanism is controlled and driven depending on the pressure detected bysaid pressure sensor, thereby clamping the plastic substrate boardbetween the both molds with an ordinary clamping force or a clampingforce of a strength not causing a trouble to the mounted component dueto the deformation.

It is preferable that the oil pressure adjustment of the pistonextruding liquid chamber and the piston retracting liquid chamber ofsaid hydraulic pressure generating cylinder is performed independentlyby respective oil pressure adjusting apparatuses depending on thepressure detected by pressure sensors provided correspondingly to therespective liquid chambers, because the substrate board can be clampedmore properly.

In a method of resin encapsulation and a mold apparatus for resinencapsulation in accordance with the present invention, a plasticsubstrate board is clamped so as not to cause a deformation, and resinis then filled to an extent that an electronic component and a wireextending therefrom are almost covered. This results in an effect that atrouble, such as the elongation and the breakage of a wire, does notoccur even when the clamping force is increased in the second clampingstep.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is an exploded and perspective view showing a first embodiment ofa mold apparatus for resin encapsulation in accordance with the presentinvention.

FIG. 2 is a front crossectional view of the mold apparatus shown in FIG.1.

FIG. 3 is a side crossectional view of the mold apparatus shown in FIG.1.

FIG. 4 is a fragmentary front crossectional view of the mold apparatusshown in FIG. 1 before operation.

FIG. 5 is a fragmentary front crossectional view of the mold apparatusshown in FIG. 1 after operation.

FIG. 6 is an operation diagram of the mold apparatus shown in FIG. 1.

FIG. 7 is an operation diagram of the mold apparatus, continued fromFIG. 6.

FIG. 8 is an operation diagram of the mold apparatus, continued fromFIG. 7.

FIG. 9 is an exploded and perspective view showing a second embodimentof a mold apparatus for resin encapsulation in accordance with thepresent invention.

FIG. 10 is a fragmentary front crossectional view of the mold apparatusshown in FIG. 9 before operation.

FIG. 11 is a fragmentary front crossectional view of the mold apparatusshown in FIG. 9 after operation.

FIG. 12 is an exploded and perspective view showing a third embodimentof a mold apparatus for resin encapsulation in accordance with thepresent invention.

FIG. 13 is a front crossectional view of the mold apparatus shown inFIG. 12.

FIGS. 14(A) and 14(B) are a fragmentary front crossectional view and aenlarged crossectional view of the mold apparatus shown in FIG. 12.

FIGS. 15(A) and 15(B) are a plan view and a front view of a lower moldset of a mold apparatus for resin encapsulation in accordance with thepresent invention, where a cylinder block for pistons is installed.

FIGS. 16(A) and 16(B) are a plan view and a front view of a lower moldset of a mold apparatus for resin encapsulation in accordance with thepresent invention, where a cylinder block for pistons is installed.

FIG. 17 is a front crossectional view showing another form of usage of amold apparatus for resin encapsulation in accordance with the presentinvention.

FIGS. 18(A) and 18(B) are a plan view and a front view of a lower moldset of a mold apparatus for resin encapsulation in accordance with thepresent invention, where a normal base block having ejector rods isinstalled.

FIG. 19 is an operation diagram of the mold apparatus shown in FIG. 12.

FIG. 20 is an operation diagram of the mold apparatus, continued fromFIG. 19.

FIG. 21 is an operation diagram of the mold apparatus, continued fromFIG. 20.

FIG. 22 is a front crossectional view showing a fourth embodiment of amold apparatus for resin encapsulation in accordance with the presentinvention.

FIG. 23 is a general perspective view of the mold apparatus for resinencapsulation shown in FIG. 22, when a chase is inserted.

FIGS. 24 are process diagrams showing a method of resin encapsulation inaccordance with the present embodiment; FIG. 24(A) shows the originalposition state; FIG. 24(B) shows a material supplying state; FIG. 24(C)shows a mold clamping state; and FIG. 24(D) shows a cavity-bar clampingstate.

FIGS. 25 are process diagrams showing a method of resin encapsulation inaccordance with the present embodiment; FIG. 25(A) shows the state of afirst resin filling step; FIG. 25(B) shows the state of a secondclamping step; FIG. 25(C) shows the state of a second resin fillingstep; and FIG. 25(D) shows the state of mold opening.

FIGS. 26 are process diagrams showing a method of resin encapsulation inaccordance with the present embodiment; FIG. 26(A) shows a productejection state; and FIG. 26(B) shows a maintenance state.

FIG. 27 is a chart of transfer position and substrate-board clampingforce.

FIG. 28 is a front crossectional view of a mold apparatus for resinencapsulation in accordance with an alteration of the presentembodiment.

FIG. 29 is a front crossectional view of a mold in accordance with theprior art.

BEST MODE FOR CARRYING OUT THE INVENTION

Embodiments in accordance with the present invention are described belowwith reference to the attached drawings of FIGS. 1 to 28.

A mold apparatus for resin encapsulation in accordance with a firstembodiment is generally constituted of an upper mold set 10 involving anupper chase 20 and a lower mold set 30 involving a lower chase 50, asshown in FIGS. 1 to 8.

The upper mold set 10 is configured so that side blocks 12 are disposedin both edge side sections of the lower surface of an upper base plate11, as shown in FIG. 2. Guiding rails 13, 13 are provided on the opposedinward surfaces of said side blocks 12. The upper chase 20 describedlater can be slidably engaged thereto from the side direction.

Said upper chase 20 is configured so that a pin plate 22 and an ejectorplate 23 are serially stacked on the center of the upper surface of aholder base plate 21 and that space blocks 24 for chase are disposed onboth sides thereof thereby to form engagement guiding grooves 25, asshown in FIGS. 1 and 2. On the other hand, upper cavity bars 27 aredisposed on both sides of a cull block 26 disposed on the center of thelower surface of said holder base plate 21. FIG. 1 shows an upper setblock 28 for positioning the upper chase 20 relatively to a lower chase50 described later.

The lower mold set 30 is configured so that a base plate 33 for lowerchase is assembled via space blocks 32 disposed in both edge sidesections of the upper surface of a lower base plate 31, as shown inFIGS. 1 and 2. An equi-pressure cylinder block 34 for plunger isdisposed in the middle of said opposed space blocks 32. In theequi-pressure cylinder block 34 for plunger, the plunger 35 is movablereciprocatingly in the axial direction through a through hole providedin said base plate 33 for lower chase.

Further, as shown in FIG. 1, cylinder blocks 40 for piston are disposedon both sides of the equi-pressure cylinder block 34 for plunger. Sideblocks 36 are disposed in both edge side sections of the upper surfaceof said base plate 33 for lower chase, and an end block 37 is disposedin an end section of the upper surface. Guiding rails 36 a, 36 a forslidably engaging the lower chase 50 described later are formed in theopposed inward surfaces of said side blocks 36.

In said cylinder block 40 for piston, as shown in FIG. 2, a space 40 asealed by a cylinder cover 41 is separated into an upper liquid chamber43 and a lower liquid chamber 44 by a skirt section 42 and a packing(not shown) of a piston 42. The upper liquid chamber 43 and the lowerliquid chamber 44 are connected through supplying and exhaustingopenings 43 a, 44 a (FIG. 3) in communication therewith respectively toan oil hydraulic pump (not shown). The upper end section 45 a of a rod45 extending in the coaxial direction from said piston 42 is extrudingfrom a through hole 33 b provided in said base plate 33 for lower chase(FIG. 2). The upper end section 45 a of said rod 45 is formed so as toslidably engage with an attach and detach block 55 described later.Further, the upper end section 45 a of said rod 45 can be directlyengaged with a lower cavity bar 56 without the attach and detach block55.

The rod 45 of the piston 42 and the base plate 33 are provided withthrough holes 45 b, 33 d for operation check so as to be communicatingin a common straight line, as shown in FIG. 3. A light source 38 a of anoptical fiber is positioned on one side of the through hole 33 d foroperation check, and a light sensor 38 b is disposed on the other side.Thus, in an abnormal case that the piston 42 can not restore to apredetermined position because of a jam and the like, the light is beinginterrupted. The light sensor 38 b detects this situation, thereby tocause an emergency stop of the driving.

As the lower chase 50 is shown in FIGS. 1 and 2, space blocks 52 aredisposed on the both edges of the lower surface of the lower holder baseplate 51 which forms guiding grooves 53, and a center block 54 isdisposed on the center of the upper surface of the lower holder baseplate 51. The center block 54 is provided with through holes 54 a in apredetermined pitch, and encapsulation resin tablets inserted into thethrough holes 54 a can be pushed out by said plungers 35. An attach anddetach block 55 is disposed on each side of said center block 54 in aposition allowing the slidable engagement with the rod 45 of said piston42. The lower end section of the attach and detach block 55 is slidablyengageable with the upper end section 45 a of said rod 45, and the upperend section thereof is slidably engaged with a lower cavity bar 56.Further, as described above, the upper end section 45 a of the rod 45can be slidably engaged directly with the lower cavity bar 56.

FIG. 1 shows a lower set block 57 for positioning the upper chase 20relatively to a lower chase 50.

A guiding mechanism section 60 shown in FIGS. 4 and 5 is adjacent to theoutward surface of said lower cavity bar 56. The guiding mechanismsection 60 is constituted of an up-down movable block 61 and a guidingblock 62, being adjacent with each other. Said up-down movable block 61and said guiding block 62 are in contact with each other via respectivetapered surfaces 61 a, 62 a. The up-down movable block 61 is sufferingan upward pressure by a spring plunger 63. However, the up-down movableblock 61 and the guiding block 62 can not be freely removed because itis coupled with a fixing pin 65 having a spring 64.

The encapsulation process of the mold apparatus for resin encapsulationhaving the above-mentioned component configuration is described below.

As shown in FIGS. 6(A) and 6(B), a plastic substrate board 70 is placedon the lower cavity bar 56, and a solid tablet 71 is inserted into thethrough hole 54 a. The lower mold set 30 is pushed up by a drivingmechanism not shown, whereby the lower mold set 30 is clamped to theupper mold set 10 (FIG. 6(C)).

As shown in FIGS. 4 and 5, when the lower mold set 30 rises, the lowersurface of the upper holder base plate 21 contacts to the up-downmovable block 61 and pushes it down. Accordingly, the up-down movableblock 61 presses the guiding block 62 laterally via the tapered surfaces61 a, 62 a, and the guiding block 62 is then positioned in a normalposition for guiding the lower cavity bar 56. In this clamping state,the gap between the lower cavity bar 56 and the guiding block 62 keeps aspacing (0.001–0.015 mm) allowing the lower cavity bar 56 to slide.Thus, the up-down movement of the lower cavity bar 56 can be secured forcompensating the variation of thickness of substrate boards.

Then, as shown in FIG. 7(A), the lower liquid chamber 44 is suppliedwith oil to push up the piston 42. The lower cavity bar 56 is lifted upvia the rod 45 and the attach and detach block 55, or directly, wherebythe substrate board 70 is clamped by the lower cavity bar 56 and theupper cavity bar 27. Further, the plunger 35 of the equi-pressurecylinder block 34 is lifted up, and the solid tablet 71 is fluidified byheating compression, and by injecting the resin, the substrate board 70(FIG. 7(B)) is encapsulated and formed. Then, the lower mold apparatus30 is lowered down to open the mold (FIG. 7(C)).

At this time, the load by the upper holder base plate 21 on the up-downmovable block 61 is lost. Accordingly, the up-down movable block 61 ispushed up by the spring force of the spring plunger 63. Therefore, thepressing force on the guiding block 62 is released, and the guidingblock 62 becomes movable sidewardly, then it evacuates from apredetermined position for positioning the lower cavity bar 56. As aresult, even when the piston 42 rises considerably during themaintenance of the lower cavity bar 56, no sliding resistance occurs inthat section because the guiding block 62 is evacuated from thepredetermined position for positioning the lower cavity bar 56.Therefore, this has an advantage of non-occurrence of a scuffing or asticking problem (locking) to the guiding block 62.

By lifting plunger 35 of the equi-pressure cylinder block 34 up higherthan the position for resin encapsulation, and after lifting up theproducts from the lower cavity bar 56, the formed product is gripped bya carrier not shown, then the product is taken out.

A relief (not shown) may be provided in a part of the lower mold set 30in order to pick up the product without lifting-up of the plunger of theequi-pressure cylinder block. Also, an ordinary ejector mechanism may beused for ejection.

The cleaning of the lower cavity bar 56 is carried out in the situationthat the piston 42 is lifted up to the highest position and that thelower cavity bar 56 is then slid and extracted sidewardly. At this time,the extraction can be performed by removing a part of the components inthe slide direction, depending on the extent of the cylinder stroke(highest lifted-up position).

A second embodiment is the same as the above-mentioned first embodimentexcept for the point that the upper end sections 45 a of the rod 45extending from the piston 42 are linked by a synchronization bar 46, asshown in FIGS. 9 to 11. The same section is designated with the samenumber, and the description is omitted.

In accordance with the second embodiment, since the pistons 42 arelinked by a synchronization bar 46, no time lag occurs in the operationof each piston 42, and the response of the pistons 42 is much improved.Thus, the lower cavity bar 56 supported by the pistons 42 is pushed upsimultaneously, and hence the lower cavity bar 56 neither slants nordeforms. Therefore, the slidability of the lower cavity bar 56 improves,so that no flash occurs, and whereby the yield rate advantageouslyimproves.

Although a solid tablet is used as solid resin for encapsulation in thedescription of the above-mentioned embodiment, it is not a necessaryrestriction. Granular or powder solid resin may be used.

Further, the fluidification of said solid resin for encapsulation may becarried out by a simple compression alone instead of the heatingcompression.

The third embodiment in accordance with the present invention isdescribed below with reference to the attached drawings of FIGS. 12 to21.

A mold apparatus for resin encapsulation in accordance with the thirdembodiment is generally constituted of an upper mold set 110 involvingan upper chase 120 and a lower mold set 130 involving a lower chase 150and a block 140, as shown in FIG. 12.

The upper mold set 110 is configured so that side blocks 112 aredisposed in both edge side sections of the lower surface of an upperbase plate 111, as shown in FIG. 12. Guiding rails 113, 113 are providedon the opposed inward surfaces of said side blocks 112, as shown in FIG.13. The upper chase 120 described later can be slidably engaged theretofrom the side direction.

A heat insulating plate 114 and a plate 115 are serially stacked on theupper surface of the upper base plate 111, as shown in FIG. 13. Further,a heater 116 for the mold heating is embedded in the upper base plate111.

Said upper chase 120 is configured so that a pin plate 122 and anejector plate 123 are serially stacked on the center of the uppersurface of a holder base plate 121 and that space blocks 124 for chaseare disposed on both side edge sections of the holder base plate 121thereby to form engagement guiding grooves 125, as shown in FIGS. 12 and13. On the other hand, upper cavity bars 127 constituting the uppermolds are disposed on both sides of a cull block 126 disposed on thecenter of the lower surface of said holder base plate 121.

FIG. 12 shows an upper set block 128 for positioning the upper chase 120relatively to a lower chase 150 described later.

The lower mold set 130 is configured so that a base plate 133 for lowerchase is attached via space blocks 132 disposed in both edge sidesections of the upper surface of a lower base plate 131, as shown inFIGS. 12 to 14. The space block 132 is formed by a heat insulating plate138 and space block sections 132 a, 132 b.

An equi-pressure cylinder block 134 for plunger is disposed in themiddle of said opposed space blocks 132, as shown in FIG. 13. In theequi-pressure cylinder block 134 for plunger, the plunger 135 is movablereciprocatingly in the axial direction through a through hole providedin a block 140. Further, support blocks 139 are disposed on both sidesof the equi-pressure cylinder block 134 for plunger.

As shown in FIGS. 12 and 13, a base block 133 c for lower chase in whicha heater 164 is embedded and a plate 133 d form a recess 133 a on thecenter of the upper surface of said base plate 133 for lower chase. Therecess 133 a can be slidably engaged with a block 140 described later.The front surface of said block 140 is positioned in contact with thestep section of the recess 133 a. Further, said base plate 133 for lowerchase carries side blocks 136 in both edge side sections thereof andcarries an end block 137 in one end section of the upper surfacethereof, as shown in FIG. 12.

Said end block 137 is formed by the stack of a heat insulating plate 147b and end blocks 137 a, 137 b, as shown in FIG. 15(B). On the otherhand, said side block 136 is formed by a heat insulating plate 147 andside block sections 136 b, 136 c, 136 d, as shown in FIG. 14(A). In saidside blocks 136, 136 as shown in FIG. 13, guiding rails 136 a, 136 a forslidably engaging a lower chase 150 described later are formed on theopposed inward surfaces thereof, and heaters 148 are embedded therein.

A cylinder block 140 a, which is one of the blocks 140, comprises aspace sealed by a cylinder cover 141, as shown in FIG. 14(B). The spaceis separated into an upper liquid chamber 143 and a lower liquid chamber144 by a skirt section 142 a and a packing (not shown) of a piston 142.Said upper liquid chamber 143 and said lower liquid chamber 144 areconnected through supplying and exhausting openings 143 a, 144 a incommunication therewith respectively to an oil hydraulic pump (notshown). The upper end section 145 a of a rod 145 extending in thecoaxial direction from said piston 142 is extruding from a cylinderblock 140 a for piston provided in said base plate 133 for lower chase.

The upper end section 145 a of said rod 145 is formed so as to slidablyengage with an attach and detach block 155 linked to a heat insulatingplate 158. The upper end section 145 a of said rod 145 may be directlyengaged with a lower cavity bar 156 without the attach and detach block155. However, even in that case, it is preferable that a heat insulatingplate 158 is attached to the linkage section.

The upper end sections 145 a of said rods 145 are linked by asynchronization bar 146. Accordingly, no time lag occurs in theoperation of each piston 142, and the response of the pistons 142 ismuch improved. Thus, the lower cavity bar 156 supported by the rods 145extending in the coaxial direction from the pistons 142 is pushed upsimultaneously, and hence the lower cavity bar 156 (lower mold) neitherslants nor deforms. Therefore, the slidability of the lower cavity bar156 improves, whereby no plastic flash occurs, and whereby the yieldrate advantageously improves.

In said lower chase 150, as shown in FIGS. 12 to 14, space blocks 152are disposed in both edge side sections of the lower surface of a lowerholder base plate 151 thereby to form guiding grooves 153 (FIG. 13).Further, a center block 154 is disposed on the center of the uppersurface of said lower holder base plate 151 (FIG. 14).

The space block 152 is formed by a heat insulating plate 159 and spaceblock sections 152 a, 152 b, as shown in FIG. 14(A). Further, saidcenter block 154 is provided with through holes 154 a in a predeterminedpitch, and pots 154 b are set, as shown in FIG. 13. As such, solidtablets 171 described later inserted into said pots 154 b are pushed outby said plungers 135.

Further, heaters 149 are provided between said pots 154 b and on theboth end sides, as shown in FIG. 16. Accordingly, the solid tablets 171can be heated from the vicinity of the pots 154 b, and meltedefficiently.

In this case, the temperature of the lower chase 150 is adjusted by theheater 148 embedded in the side block 136 b and the heaters 149 setbetween the pots 154 b. However, the heater 164 embedded in the baseblock 133 c for lower chase is not used.

A support block 160 for chase is provided for supporting the lowerholder base plate 151 so as not to deform elastically. The support block160 for chase is formed by a heat insulating plate 160 c, a flangedsupport block 160 a for chase, and a non-flanged support block 161 forchase, as shown in FIG. 14(A). The flange section of said flangedsupport block 160 a for chase is used for forming a space extending tothe pot 154 b. Said space permits easy guiding and positioning of theheater wires of the heaters 149 provided between the pots 154 b, whichimproves easiness in assembling.

An attach and detach block 155 is disposed on each side of said centerblock 154. The attach and detach block 155 is integrated with a heatinsulating plate 158, and the lower end surface thereof is slidablyengageable with the upper end section 145 a of said rod 145.

Further, the upper end section 145 a of the rod 145 can be slidablyengaged directly with the lower cavity bar 156. Even in that case, it ispreferable that a heat insulating plate 158 is attached to the linkagesection.

As such, the heat insulating plates 147, 158, 159, 160 c are provided inthe surroundings of the cylinder block 140 a for piston, whereby thetemperature rise can be suppressed in the cylinder block 140 a forpiston. Further, the rise of cylinder oil temperature and the like canbe suppressed, whereby a stable pressure can be supplied, and thetemperature deterioration of the oil and the like can be avoided. Forexample, in case of the temperature of the cavity section is about 180°C., the temperature of the cylinder block 140 a for piston is suppressedto about 120° C.

FIG. 12 shows a lower set block 157 for positioning the lower chase 150relatively to the upper chase 120.

The encapsulation process of the mold apparatus for resin encapsulationis described below for the case that the cylinder block 140 a isinvolved as a block 140. The present embodiment is an encapsulationprocess without using the attach and detach block 155.

As shown in FIGS. 19(A) and 19(B), a plastic substrate board 170 isplaced on the lower cavity bar 156, and a solid tablet 171 is insertedinto the pot 154 b. The lower mold set 130 is pushed up by a drivingmechanism not shown, whereby the lower mold set 130 is clamped to theupper mold set 110 (FIG. 19(C)).

Then, as shown in FIG. 20(A), the lower liquid chamber 144 is suppliedwith oil to push up the piston 142. The lower cavity bar 156 is liftedup by the rod 145, whereby the plastic substrate board 170 is clamped bythe lower cavity bar 156 and the upper cavity bar 127. Further, theplunger 135 of the equi-pressure cylinder block 134 is lifted up, andthe solid tablet 171 is fluidified by heating compression, and byinjecting the resin, the substrate board 170 (FIG. 20(B)) isencapsulated and formed. Then, the lower mold apparatus 130 is lowereddown to open the mold (FIG. 20(C)).

By lifting the plunger 135 of the equi-pressure cylinder block 134 uphigher than the position for resin encapsulation, and after lifting upthe formed product from the lower cavity bar 156 (FIG. 21(A)), theformed product is gripped by a carrier not shown, then the formedproduct is taken out.

A relief (not shown) maybe provided in a part of the lower mold set 130in order to pick up the formed article via said relief withoutlifting-up of the plunger 135 of the equi-pressure cylinder block 134.

The cleaning of the lower cavity bar 156 is carried out in the situationthat the piston 142 is lifted up to the highest position and that thelower cavity bar 156 is then slid and extracted sidewardly from the rod145, as shown in FIG. 21(B). At this time, the extraction can beperformed after removing a removal block 163 (FIG. 12) locking in theslide direction, depending on the extent of the cylinder stroke (highestlifted-up position).

Although a solid tablet is used as solid resin for encapsulation in thedescription of the above-mentioned embodiment, it is not a necessaryrestriction. Granular or powder solid resin may be used. Further, thefluidification of said solid resin for encapsulation may be carried outby a simple compression alone instead of the heating compression.

A mold apparatus for resin encapsulation in accordance with the presentinvention can encapsulate a metallic substrate board, as required.

That is, in case of encapsulation of a metallic substrate board, thecylinder block 140 a is changed to a normal base block 140 b havingejector rods as shown in FIG. 12, and the upper and the lower chases120, 150 are changed to an upper and a lower chases for metallicsubstrate boards, which are not shown. In said normal base block 140 bhaving ejector rods, two ejector rods 162 b are disposed adjacently to ahandle for insertion and extraction (FIG. 17, 18).

On the other hand, two ejector rods 162 a are previously involved in astep section adjacent to the end block 137 of the lower mold set 130(FIGS. 12 and 18). Accordingly, the two ejector rods 162 a and the twoejector rods 162 b push up said lower chase for metallic substrateboards.

A support block 139 for preventing the elastic deformation of the baseblock 133 for lower chase is fixed to the lower mold set 130. Thus, whenthe normal base block 140 b having ejector rods is involved in place ofthe cylinder block 140 a for piston, into the lower mold set 130, allthe elements of a conventional lower mold set for metallic substrateboards are completed. As a result, the situation becomes substantiallyidentical to the prior art example shown in FIG. 29, and hence metallicsubstrate boards can be encapsulated with resin using a conventionallower chase for metallic substrate boards.

The encapsulation process of a metallic substrate board is almost thesame as the encapsulation process of a plastic substrate board, andhence the description is omitted. Here, the temperature of the lowerchase for metallic substrate boards is adjusted by a heater 164 of thebase block 133 c for lower chase and a heater 165 of the normal baseblock 140 b having ejector rods. A heater 148 of the side block 136 b isnot used.

A mold apparatus for resin encapsulation in accordance with the presentinvention is not only capable of performing the resin encapsulation ofone side of a plastic substrate board and a metallic substrate board butalso capable of performing the resin encapsulation of both sides thereofwhen the upper and the lower cavity bar are changed properly.

Further, said normal base block may be used for the encapsulation of aplastic film and the like as well as the encapsulation of a metallicsubstrate board.

The normal base block 140 b is unnecessary to be one piece, and may beseparable into some small blocks, for example, into a small blockinvolving the ejector rod and other small blocks.

A fourth embodiment in accordance with the present invention isdescribed below with reference to the attached drawings of FIGS. 22 to28.

FIG. 22 shows a multi-plunger type mold apparatus for resinencapsulation in accordance with the fourth embodiment. The moldapparatus for resin encapsulation is generally constituted of a moldapparatus 201 and an oil pressure adjusting apparatus 202.

The mold apparatus 201 is composed of a fixed side mold 203 and amovable side mold 204 as shown in FIG. 23. In the fixed side mold 203, afixed side chase 206 is provided detachably in a fixed side mold set205. In the fixed side mold set 205, a fixed side base plate 207 and apair of side blocks 208 form a fixed side space 209. The fixed sidespace 209 opens downwardly and to one side. On the opposed surfaces ofthe side blocks 208, guiding rails 210 extending to the side opening areformed.

In the fixed side chase 206, a cavity bar 212, a cull block 213, and aspace block 214 for chase are assembled to a holder base plate 211. Inthe cavity bar 212, a fixed side cavity 215 is formed. The fixed sidechase 206 is further provided with a pin plate 216, an ejector plate217, and a support pin (not shown). In the side surfaces of the fixedside chase 206, guiding grooves 219 are formed for engaging with theguiding rails 210 of said side blocks 208, and a handle 220 is providedin the end surface. Using the handle 220, an operator can easily attachand detach the fixed side chase 206 by sliding it to the fixed sidespace 209.

In the movable side mold 204, a movable side chase 222 is provideddetachably in a movable side mold set 221. In the movable side mold set221, a space block 224 and a base plate 225 for movable side chase areserially provided on a movable side base plate 223, and side blocks 226are provided on the base plate 225 for movable side chase. The baseplate 225 for movable side chase and the side blocks 226 form a movableside space 227 opening upwardly and to one side.

As shown in FIG. 22, an equi-pressure cylinder block 228 is provided onthe center of said movable side base plate 223. The equi-pressurecylinder block 228 is linked at the rear end by a transfer plate 229,and driven back and forth by a driving mechanism not shown.

Pressurizing cylinders 230 are provided on both sides of theequi-pressure cylinder block 228 between said space blocks 224. In eachpressurizing cylinder 230, a piston 233 is provided in a liquid chamber234, 235 formed by a cylinder block 231 and a cylinder cover 232, anddriven independently. In a lower liquid chamber 234 which is a liquidchamber for extrusion and separated by the piston 233, a pressurereceiving opening 234 a is formed. In an upper liquid chamber 235 whichis a liquid chamber for retraction, a back pressure opening 235 a isformed. Oil from the oil pressure adjusting apparatus 202 describedlater is supplied or exhausted through those openings. A rod 236extending from the piston 233 passes through the cylinder cover 232 andthe base plate 225 for movable side chase, and is exposed in the uppersurface of the base plate 225 for movable side chase. The exposed tipsection of the rod 236 is an engaging section 237 generally having a boxshape. Here, said pressurizing cylinders 230 may be built in the baseplate 225 for movable side chase.

A movable side chase 222 is an integration of a cavity bar 238, a centerblock 239, a holder base plate 240, a space block 241 for chase, and asupport pin 242. The cavity bar 238 is linked via an attach and detachblock 244 to the engaging section 237 of the tip of said rod 236. Thecenter block 239 is provided with a through hole within which a plungerchip 228 a linked to the tip section of said equi-pressure cylinderblock 228 slides, whereby a pot section 243 is constituted. The potsection 243 is supplied with resin to fill into the cavity. Similarly tosaid fixed side mold set 205, the opposed surfaces of the side blocks226 are provided with guiding rails 245, and the side surfaces of themovable side chase 222 are provided with guiding grooves 246 forengaging with the guiding rails 245 and a handle 247.

The oil pressure adjusting apparatus 202 actuates an electrical liquidpressure generating cylinder 249 with a servo motor 248, thereby todrive the pressurizing cylinder 230 provided in said movable side mold204.

It is noted that a rotary pump or reciprocating pump with a motor may beused instead of the electrical liquid pressure generating cylinder 249with a servo motor 248. The rotary pump includes a gear pump, a vanepump, a screw pump. The reciprocating pump includes a radial pistonpump, an axial piston pump, a reciprocating piston pump.

The servo motor 248 transfers a driving force through a timing belt 251over pulleys 250 a, 250 b to a ball screw 252. The ball screw 252 isengaged with a nut section 254 retained by a bracket 253. The bracket253 is supported rotatably through a bearing 255 by a block 256. Theblock 256 is fixed to a main body bracket 202 a. The lower end sectionof said nut section 254 is linked through a shaft 259 to a movable plate260. The movable plate 260 is slidable up and down along four guidingshafts 258 passing therethrough via bushings 257. The center of thelower surface of the movable plate 260 is linked to the piston rod 261of the liquid pressure generating cylinder 249. In the liquid pressuregenerating cylinder 249, an upper liquid chamber 263 and a lower liquidchamber 264 are formed by a piston 262 disposed in the cylinder. Theupper liquid chamber 263 is connected through a first hose 265 a to aback pressure opening 235 a, and in communication with the upper liquidchamber 235 of said pressurizing cylinder 230. The lower liquid chamber264 is connected through a second hose 265 b to a pressure receivingopening 234 a, and in communication with the lower liquid chamber 234 ofsaid pressurizing cylinder 230. A single-action cylinder 266 is providedin the middle of the first hose 265 a. The single-action cylinder 266serves as a buffer during the clamping of a substrate board. A pressuresensor 267 is provided in the middle of the second hose 265 b. Theliquid pressure detected by the pressure sensor 267 is input to acontrolling apparatus 268. The controlling apparatus 268 controls anddrives said servo motor 248 depending on the detected liquid pressure.Here, said pressure sensor 267 detects a reduced pressure state, therebypermitting the position control of the equi-pressure cylinder block 228.

The operation of said mold apparatus for resin encapsulation isdescribed below.

In the initial state (original position) shown in FIG. 24(A), themovable side mold 204 is lowered down by a driving mechanism not shown,and is apart from the fixed side mold 203 (encapsulate preparingprocess). At that time, the equi-pressure cylinder block 228 moves down,and the pot section 243 is formed in the center block 239. Further, theservo motor 248 shown in FIG. 22 drives the piston 262 to move up, andthe pressure of both the upper liquid chamber 263 of the liquid pressuregenerating cylinder 249 and the upper liquid chamber 235 of pressurizingcylinder 230 increases. As a result, the piston 233 moves down, and thecavity bar 238 retracts to a position not to contact to the cavity bar212 of the fixed side mold 203 even when the mold is closed. Then, asshown in FIG. 24(B), a substrate board P is automatically supplied intothe movable side mold 204 and positioned by a transferring apparatus notshown, and forming resin R is supplied into said pot section 243(material supplying process).

Then, the movable side mold 204 is lifted up thereby to close the moldas shown in FIG. 24(C) (mold clamping process). Further, as shown inFIG. 24(D), the lower liquid chamber 234 of the pressurizing cylinder230 is supplied with oil, whereby the piston 233 is lifted up, and thesubstrate board P is clamped by the cavity bar 238 (first clampingprocess). The clamping force used here is 70–80% of the ordinary force.This suppresses the amount of deformation of the plastic substrate boardP supplied automatically, thereby preventing the elongation and thebreakage of a wire extending from an electronic component mounted on thesurface.

After that, as shown in FIG. 25(A), the equi-pressure cylinder block 228is lifted up, whereby the resin R supplied in the pot section 243 ismelted to fill into the cavity (first resin filling process). Theequi-pressure cylinder block 228 is moved with a large initial amount ofthe movement and with subsequent deceleration to a constant speed, forexample, as shown in FIG. 27(A). The amount of the resin filled here isset to be 80–90% of the complete filling, which is an extent thatelectronic components and wires mounted on the substrate board P arealmost covered. By the covering of the electronic components and thewires, the influence of the deformation in the next second clampingprocess is alleviated, and the leak of the resin is avoided even with aweak clamping force.

After that, as shown in FIG. 25(B), the lower liquid chamber 234 of thepressurizing cylinder 230 is supplied with more oil, whereby the forceof clamping the substrate board P by the cavity bar 238 is increased to100% (second clamping process). In that case, electronic components andwires mounted on the substrate board P are (completely or partially)covered with resin. Therefore, a small deformation of the substrateboard P due to the increased clamping force does not cause an adverseinfluence, such as the deformation of electronic components and wires.

After that, as shown in FIG. 25(C), the equi-pressure cylinder block 228is further lifted up, whereby the filling of resin into the cavity iscompleted (second resin filling process). Since the clamping force hasbeen increased to 100% in said second clamping process, the resin doesnot leak from the contacting faces of the molds. Thus, no flash occurs.

Finally, as shown in FIG. 25(D), the movable side mold 204 is lowereddown to open the mold (mold opening process). The equi-pressure cylinderblock 228 is lifted up above the resin encapsulation position as shownin FIG. 26(A). The product is picked up from the mold. The product isgripped by a carrier not shown, and is ejected from the mold (productejecting process). A relief for the claw section of the carrier may beprovided in the mold in order to pick up the product using the carrieralone without lifting-up of the equi-pressure cylinder block 228.

As such, in said method of resin encapsulation, a plastic substrateboard is clamped with deformation being suppressed in the first clampingprocess, and resin is then filled to an extent that an electroniccomponent and a wire extending therefrom are almost covered. Therefore,a trouble, such as the elongation and the breakage of a wire, does notoccur even when the clamping force is increased in the second clampingstep.

In case of the maintenance of said multi-plunger type mold apparatus forresin encapsulation, as shown in FIG. 26(B), the piston 233 is lifted upto the upper dead point, thereby pushing out and removing the cavity bar238. Then, the maintenance of the cavity bar 238 is carried out. In thepresent mold apparatus, the fixed side chase 206 and the movable sidechase 222 can be extracted and inserted. In case of item change, a molditem can be changed only by changing said chases 206, 222 and theequi-pressure cylinder block 228. Thus, the work efficiency in themaintenance is very high. There is a case that the change of the cavitybar 238 alone instead of said chase 222 is enough, depending on theitem.

Although the pressurizing cylinder 230 is supplied with oil by a singleoil pressure adjusting apparatus 202 in said embodiment, oil pressureadjusting apparatuses may be provided in respective pressurizingcylinders 230.

As shown in FIG. 28, the oil pressure of the upper liquid chamber 235and the lower liquid chamber 234 of each pressurizing cylinder 230 maybe independently adjusted by separate oil pressure adjusting apparatuses300, 301. That is, the upper liquid chamber 235 of the pressurizingcylinder 230 is in communication with the lower liquid chamber 303 ofthe oil pressure adjusting apparatus 300 via a hose 302. A pressuresensor 304 is provided in the middle of the hose 302, thereby detectingthe oil pressure of the upper liquid chamber 235 of the pressurizingcylinder 230, thereby inputting it to a controlling apparatus 305. Thecontrolling apparatus 305 controls and drives a servo motor 306depending on the detected pressure. Similarly, the lower liquid chamber234 of the pressurizing cylinder 230 is in communication with the lowerliquid chamber 308 of the oil pressure adjusting apparatus 301 via ahose 307. A pressure sensor 309 is provided in the middle of the hose307, thereby detecting the oil pressure of the lower liquid chamber 234of the pressurizing cylinder 230. A controlling apparatus 310 similarlycontrols and drives a servo motor 311.

As such, during the extrusion and the retraction of the piston 233 ofthe pressurizing cylinder 230, a desired oil pressure can be obtain ineach liquid chamber 234, 235, permitting a smooth and fast operation.

Although the clamping force is increased immediately to a predeterminedpressure in said first and second clamping process, a multi-step controlmay be used.

INDUSTRIAL AVAILABILITY

The present invention is applicable to a mold apparatus for resinencapsulation and a method of resin encapsulation used for encapsulatingan mounted component, such as a semiconductor device, with resin.

1. In a mold apparatus for resin encapsulation, wherein a substrateboard is clamped by both an upper mold disposed in the lower surface ofan upper mold set and a lower mold disposed in the upper surface of alower mold set, wherein a plunger provided in any one of said mold setsis extruded whereby solid resin for encapsulation is fluidified, andwherein an electronic component mounted on the surface of said substrateboard is encapsulated with the resin, a mold for resin encapsulation,wherein any one of said molds is supported by plural pistons provided inparallel, wherein said pistons are inserted slidably within an oilhydraulic cylinder block provided in said mold set to be able tocompensate for substrate boards having varying thicknesses, and whereinsaid plural pistons provided in parallel are linked by a synchronizationbar.
 2. In a mold apparatus for resin encapsulation, wherein a substrateboard is clamped by both an upper mold disposed in the lower surface ofan upper mold set and a lower mold disposed in the upper surface of alower mold set, wherein a plunger provided in any one of said mold setsis extruded whereby solid resin for encapsulation is fluidified, andwherein an electronic component mounted on the surface of said substrateboard is encapsulated with the resin, a mold for resin encapsulation,wherein any one of said molds is supported by plural pistons provided inparallel, wherein said pistons are inserted slidably within an oilhydraulic cylinder block provided in said mold set to be able tocompensate for substrate boards having varying thicknesses, and whereineach of the plural pistons provided in parallel and a base platesupporting the middle sections of the pistons and constituting a lowermold set are provided with respective through holes, for operationcheck, capable of communicating in a common straight line.
 3. In a moldapparatus for resin encapsulation, wherein a substrate board is clampedby both an upper mold disposed in the lower surface of an upper mold setand a lower mold disposed in the upper surface of a lower mold set,wherein a plunger provided in any one of said mold sets is extrudedwhereby solid resin for encapsulation is fluidified, and wherein anelectronic component mounted on the surface of said substrate board isencapsulated with the resin, a mold for resin encapsulation, wherein anyone of said molds is supported by plural pistons provided in parallel,wherein said pistons are inserted slidably within an oil hydrauliccylinder block provided in said mold set to be able to compensate forsubstrate boards having varying thicknesses, and wherein a guidingmechanism section comprising: an up-down movable block moving downwardlyby being pressed by the lower surface of an upper mold set; and aguiding block moving sidewardly to a guiding position of said lower moldby being pressed by the tapered surface of the up-down movable block;for guiding the lower mold with said guiding block during the moldclamping and for releasing said guiding block during the mold opening isdisposed in the vicinity of an outward surface of said lower moldattached to said lower mold set.
 4. In a mold apparatus for resinencapsulation, wherein a substrate board is clamped by both an uppermold disposed in the lower surface of an upper mold set and a lower molddisposed in the upper surface of a lower mold set, wherein a plungerprovided in any one of said mold sets is extruded whereby solid resinfor encapsulation is fluidified, and wherein an electronic componentmounted on the surface of said substrate board is encapsulated with theresin, a mold apparatus for resin encapsulation, wherein any one of themolds is supported by plural pistons provided in parallel, wherein anoil hydraulic cylinder block to which one end of each of the pluralpistons supporting any one of said molds is inserted slidably isprovided in any one of said upper mold set and said lower mold set so asto be changeable with a normal base block and to be able to compensatefor substrate boards having varying thicknesses, wherein the pluralpistons provided in parallel are linked by a synchronization bar.
 5. Amold apparatus for resin encapsulation according to claim 4, whereinsaid plural pistons supporting any one of said molds are plural pistonssupporting said lower mold and one end of each of the plural pistons areinserted slidably in said oil hydraulic cylinder block provided in saidlower mold set so as to be changeable with a normal base blockcomprising ejector rods and to be able to compensate for substrateboards having varying thicknesses.
 6. A mold apparatus for resinencapsulation of claim 5, wherein said oil hydraulic cylinder block isslidably engaged to a base plate for chase constituting the lower moldset so as to be changeable with a normal base block comprising ejectorrods.
 7. A mold apparatus for resin encapsulation of claim 4, wherein anoil hydraulic cylinder block is slidably engaged to a base plateconstituting the upper mold set so as to be changeable with a normalbase block.
 8. A mold apparatus for resin encapsulation of claim 4,wherein a heat insulating plate is disposed in at least one linkagesection between the lower mold and a space block, a side block, or anend block constituting the lower mold set.
 9. A mold apparatus for resinencapsulation of claim 4, wherein a heat insulating plate is disposed inat least one linkage section between a lower mold and a space block, asupport block, or a piston of a lower chase.
 10. A mold apparatus forresin encapsulation of claim 4, wherein a lower chase involving thelower mold is slidably engaged to the lower mold set so as to beattachable thereto and detachable therefrom.
 11. In a method of resinencapsulation, wherein a plastic substrate board is clamped between afixed side mold and a movable side mold, and wherein resin is filledinto the formed cavity, thereby encapsulating a mounted component on thesurface of said substrate board with the resin, a method of resinencapsulation comprising: a first clamping step of clamping saidsubstrate board with said both molds using a force of a strength, whichdoes not cause the deformation of said substrate board; a first resinfilling step of filling the resin into a cavity formed by said bothmolds to an extent that the mounted component is almost covered; asecond clamping step of clamping the member to be clamped, with saidboth molds in an ordinary manner; and a second resin filling step offilling the resin completely in the cavity formed by said both molds;wherein clamping is carried out with a force of 70–80% of ordinary forcein said first clamping step, and wherein the resin is filled by anamount of 80–90% of the complete filling in said first resin tillingstep.
 12. In a mold apparatus for resin encapsulation, wherein a plasticsubstrate board is clamped between a fixed side mold and a movable sidemold, and wherein resin is filled into the formed cavity, therebyencapsulating a mounted component on the surface of said substrate boardwith the resin, a mold apparatus for resin encapsulation, wherein atleast the area for clamping the plastic substrate board of said movableside mold is constituted of a clamping member movable in the clampingdirection, comprising a driving mechanism for moving said clampingmember thereby to clamp the plastic substrate board between the bothmolds with a clamping force of a strength, which does not cause thedeformation of said substrate board or an ordinary clamping force,wherein said driving mechanism is constituted of a hydraulic pressuregenerating cylinder mechanism for driving a clamping member by thehydraulic balance between a piston extruding liquid chamber and a pistonretracting liquid chamber, wherein a pressure sensor is provided fordetecting the hydraulic pressure of the extruding liquid chamber in ahydraulic pressure generating cylinder of the hydraulic pressuregenerating cylinder mechanism, and wherein said hydraulic pressuregenerating cylinder mechanism is controlled and driven depending on thepressure detected by said pressure sensor, thereby clamping the plasticsubstrate board between the both molds with an ordinary clamping forceor a clamping force of a strength, which does not cause the deformation.13. A mold apparatus for resin encapsulation of claim 12, wherein theoil pressure adjustment of the piston extruding liquid chamber and thepiston retracting liquid chamber of said hydraulic pressure generatingcylinder is performed independently by respective oil pressure adjustingapparatuses depending on the pressure detected by pressure sensorsprovided correspondingly to the respective liquid chambers.
 14. A moldapparatus for resin encapsulation of claim 1, wherein each of the pluralpistons provided in parallel and a base plate supporting the middlesections of the pistons and constituting a lower mold set are providedwith respective through holes, for operation check, capable ofcommunicating in a common straight line.
 15. A mold apparatus for resinencapsulation of claim 1, wherein a guiding mechanism sectioncomprising: an up-down movable block moving downwardly by being pressedby the lower surface of an upper mold set; and a guiding block movingsidewardly to a guiding position of said lower mold by being pressed bythe tapered surface of the up-down movable block; for guiding the lowermold with said guiding block during the mold clamping and for releasingsaid guiding block during the mold opening is disposed in the vicinityof an outward surface of said lower mold attached to said lower moldset.
 16. A mold apparatus for resin encapsulation of claim 2, wherein aguiding mechanism section comprising: an up-down movable block movingdownwardly by being pressed by the lower surface of an upper mold set;and a guiding block moving sidewardly to a guiding position of saidlower mold by being pressed by the tapered surface of the up-downmovable block; for guiding the lower mold with said guiding block duringthe mold clamping and for releasing said guiding block during the moldopening is disposed in the vicinity of an outward surface of said lowermold attached to said lower mold set.
 17. A mold apparatus for resinencapsulation of claim 1, wherein the lower mold supported by thepistons is attachable onto and detachable from the upper surface of saidlower mold set, and wherein the oil hydraulic cylinder block is clampedby a base plate and a base plate for chase constituting the top and thebottom of the lower mold set.
 18. A mold apparatus for resinencapsulation of claim 1, wherein each of the plural pistons provided inparallel and a base plate supporting the middle sections of the pistonsand constituting a lower mold set are provided with respective throughholes, for operation check, capable of communicating in a commonstraight line, and wherein the oil hydraulic cylinder block is clampedby a base plate and the base plate for chase constituting the top andthe bottom of the lower mold set.
 19. A mold apparatus for resinencapsulation of claim 1, wherein a guiding mechanism sectioncomprising: an up-down movable block moving downwardly by being pressedby the lower surface of an upper mold set; and a guiding block movingsidewardly to a guiding position of said lower mold by being pressed bythe tapered surface of the up-down movable block; for guiding the lowermold with said guiding block during the mold clamping and for releasingsaid guiding block during the mold opening is disposed in the vicinityof an outward surface of said lower mold attached to said lower moldset, and wherein the oil hydraulic cylinder block is clamped by a baseplate and a base plate for chase constituting the top and the bottom ofthe lower mold set.
 20. A mold apparatus for resin encapsulationaccording to claim 6, wherein a heat insulating plate is disposed in atleast one linkage section between the lower mold and a space block, aside block, or an end block constituting the lower mold set.
 21. A moldapparatus for resin encapsulation according to claim 6, wherein a heatinsulating plate is disposed in at least one linkage section between alower mold and a space block, a support block, or a piston of a lowerchase.
 22. A mold apparatus for resin encapsulation according to claim6, wherein the lower chase involving the lower mold is slidably engagedto the lower mold set so as to be attachable thereto and detachabletherefrom.
 23. A mold apparatus for resin encapsulation of any one ofclaims 1, 2 and 3, wherein said plunger provided in any one of said moldsets is a plunger provided in the lower mold set.
 24. A mold apparatusfor resin encapsulation of claim 23, wherein the oil hydraulic cylinderblock is clamped by a base plate and a base plate for chase constitutingthe top and the bottom of the lower mold set.
 25. A mold apparatus forresin encapsulation of any one of claims 1, 2 and 3, wherein the lowermold supported by the pistons is attachable onto and detachable from theupper surface of said lower mold set.